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Semiconductor
TFDU4100/TFDS4500/TFDT4500
2.7-5.5V Serial Infrared Transceiver Module Family (SIR, 115.2 kbit/s)
Features
D Compliant to IrDA 1.2 (up to D D D D BabyFace (Universal) Package
Applications
D Notebook Computers, Desktop
D D
115.2 kbit/s) Wide Operating Voltage Range (2.7 to 5.5 V ) Low Power Consumption (1.3 mA Supply Current) Power Sleep Mode Through VCC1/SD Pin (5 nA Sleep Current) Long Range (up to 3.0 m at 115.2 kbit/s) Three Surface Mount Package Options - Universal (9.7 x 4.7 x 4.0 mm) - Side View (13.0 x 5.95 x 5.3 mm) - Top View (13.0 x 7.6 x 5.95 mm)
D
D D
D
Capable of Surface Mount Solderability to Side- and Top-View Orientation Directly Interfaces with Various Super I/O and Controller Devices and TEMIC's TOIM3000 and TOIM3232 I/Os Few External Components Required Backward Compatible to All TEMIC SIR Infrared Transceivers Built-in EMI Protection - No External Shielding Necessary
D D D D D D
PCs, Palmtop Computers (Win CE, Palm PC), PDAs Digital Still and Video Cameras Printers, Fax Machines, Photocopiers, Screen Projectors Telecommunication Products (Cellular Phones, Pagers) Internet TV Boxes, Video conferencing systems External Infrared Adapters (Dongles) Medical and Industrial Data Collection Devices
Description
The TFDU4100, TFDS4500, and TFDT4500 are a family of low-power infrared transceiver modules compliant to the IrDA 1.2 standard for serial infrared (SIR) data communication, supporting IrDA speeds up to 115.2 kbit/s. Integrated within the transceiver modules are a photo PIN diode, infrared emitter (IRED), and a low-power analog control IC to provide a total front-end solution in a single package. TEMIC's SIR transceivers are available in three package options, including our BabyFace package (TFDU4100), the smallest SIR transceiver available on the market. This wide selection provides flexibility for a variety of applications and space constraints.
The transceivers are capable of directly interfacing with a wide variety of I/O chips which perform the pulse-width modulation/demodulation function, including TEMIC's TOIM3000 and TOIM3232. At a minimum, a current-limiting resistor in series with the infrared emitter and a Vcc bypass capacitor are the only external components required to implement a complete solution.
Package Options
TFDU4100 Baby Face (Universal) TFDS4500 Side View TFDT4500 Top View
This product is currently in devleopment. Inquiries regarding the status of this product should be directed to TEMIC Marketing.
Pending--Rev. A, 03-Apr-98
1
Pre-Release Information
TFDU4100/TFDS4500/TFDT4500
Functional Block Diagram
VCC1/SD
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Driver Amplifier Comparator Rxd
VCC2 RS IRED Anode
SC Txd
AGC Logic IRED Cathode Open Collector Driver
GND
Pin Assignment and Description
Pin Number " U ", " T " Option
1 2 3 4
"S" Option
8 1 7 2
Function
IRED Anode IRED Cathode Txd Rxd
Description
IRED anode, should be externally connected to VCC2 through a current control resistor IRED cathode, internally connected to driver transistor Transmit Data Input Received Data Output, push-pull CMOS driver output capable of driving a standard CMOS or TTL load. No external pull-up or pull-down resistor is required (20 k resistor internal to device). Pin is inactive during transmission. Do not connect Supply Voltage/Shutdown (see "Shutdown" on page 6) Sensitivity control Ground 8 7 6 5 IRED
I/O
Active
I O
HIGH LOW
5 6 7 8
6 3 5 4
NC VCC1/ SD SC GND
I
HIGH
IRED
Detector
Detector
1 2345 678 1 IRED "U" Option BabyFace (Universal) 2 3 4 Detector 1 2 3 4 5 67 8
"S" Option Side View
"T" Option Top View
2
Pending--Rev. A, 03-Apr-98
Pre-Release Information
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TFDU4100/TFDS4500/TFDT4500
Qty/ Reel
1000 pcs 1000 pcs 750 pcs 750 pcs
Ordering Information
Part Number
TFDU4100-TR3 TFDU4100-TT3 TFDS4500-TR3 TFDT4500-TR3
Description
Oriented in carrier tape for side view surface mounting Oriented in carrier tape for top view surface mounting
Absolute Maximum Ratings
Parameter
Supply Voltage Range Voltage Range of IRED Drive Output Input Currentsd Output Sink Current Power Dissipatione Junction Temperature Ambient Temperature Range (Operating) Storage Temperature Range Soldering Temperature Average IRED Current Repetitive Pulsed IRED Current IRED Anode Voltage at Current Output Transmitter Data Input Voltage Receiver Data Output Voltage Virtual Source Sizef Maximum Intensity for Class 1 Operation of IEC 825 or EN60825g IIRED (DC) IIRED (RP) VIREDA VTxd VRxd d EN60825, 1997 t < 90s, ton<20% - 0.5 - 0.5 - 0.5 2.5 2.8 400 PD TJ Tamb Tstg t = 20 s -25 -25 215
Symbol
VCC1 VCC2
Test Conditionsa
IRED anode pin, Txd LOW
Minb
- 0.5 - 0.5
Typc
Maxb
6 6 10 25 200 125 85 85 240 100 500 6 Vcc + 0.5 Vcc + 0.5
Unit
V
mA mW
C
mA
V
mm mW/sr
Notes a. Reference point GND pin unless otherwise noted. b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum. c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. d. All pins except IRED cathode pin and IRED anode pin. e. See Derating Curve f. Method: (1-1/e) encircled energy. g. Worst case IrDA SIR pulse pattern.
Pending--Rev. A, 03-Apr-98
3
Pre-Release Information
TFDU4100/TFDS4500/TFDT4500
Electrical Characteristics
Parameter Transceiver
Supply Voltage Supply Voltage Supply Current, VCC1 Pin pp y , (Receive Mode) Supply Current, VCC1 Pin ( g) pp y , (avg) (Transmit Mode) d Leakage Current of IR Emitter, IRED Anode Pin Transceiver Power On Settling Time VCC1 VCC1 IS Receive Mode Transmit Mode, R2 = 51 VCC1= 5.5V VCC1= 2.7V VCC1= 5.5V VCC1= 2.7V VCC1= OFF, Txd = LOW, VCC2 = 6V, T = 25- 85 C 2.7 2.0
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Symbol
Test Conditionsa
Minb
Typc
Maxb
Unit
5.5 5.5 1.3 1.0 5.0 3.5 0.005 50 2.5 1.5 5.5 4.5 0.5
V
mA
IS IS IS
A s
Optoelectronic Characteristics
Parameter Receiver
Eemin Min Detection Threshold Irradiancee Min Detection Threshold Irradianced Max Detection Threshold Irradianced Logic Low Receiver Input Irradiance Rxd Output Voltage Output Current Rise Time Fall Time Rxd Pulse Width of Output Signal Jitterf Latency tr tf Pw tj tL Eemin Eemax = 15_, SIR Mode, SC = LOW = 15_, SIR Mode, SC = LOW, VCC1 = 2.7V = 15_, SIR Mode, SC = HIGH = 90_, SIR Mode, VCC1 = 5V = 90_, SIR Mode, VCC1 = 3V Eemax (low) VOL VOH SC = HIGH or LOW Active, C = 15 pF, R = 2.2 k Non-active, C = 15 pF, R = 2.2 k VOL < 0.8V C = 15 pF, R = 2.2 k C = 15 pF, R = 2.2 k 115.2 kbit/s mode Over a period of 10 bit, 115.2 kbit/s 100 20 20 1.41 VCC-0.5 4 1400 200 8 2 500 s s mA ns 0.5 6 3.3 8 10 5 15 4 0.8 mW/m2 V 20 35 35 15 kW/m2 mW/m2
Symbol
Test Conditionsa
Minb
Typc
Maxb
Unit
Notes a. Tamb = 25_C, VCC = 2.7 - 5.5 V unless otherwise noted. b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum. c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. d. IIRED (peak) = 210 mA (At IRED Anode pin) e. BER = 10-8 (IrDA specification). f. Leading edge of output signal.
4
Pending--Rev. A, 03-Apr-98
Pre-Release Information
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TFDU4100/TFDS4500/TFDT4500
Symbol Test Conditionsa Minb Typc Maxb Unit
Optoelectronic Characteristics (Cont'd)
Parameter Transmitter
IRED Operating Currentd Logic Low Transmitter Input Voltage Logic High Transmitter Input Voltage Output Radiant Intensitye Output Radiant Intensity Angle of Half Intensity Peak Wavelength of Emission Halfwidth of Emission Spectrum Optical Rise Time, Fall Time Optical Overshoot Rising Edge Peak-to-Peak Jitter tj Over a period of 10 bits, independent of information content tR, tF 115.2 kHz square wave signal, duty cycle 1:1 ID VIL (Txd) VIH (Txd) IeH IeL P 880 60 200 600 25 0.2 ns % s Current limiting resistor in series to IRED: R1 = 8.2 @ VCC2 = 5V, = 15_ Logic Low Level 24 900 Current limiting resistor is series to IRED: R1 = 8.2 , VCC2 = 5V 0 2.4 45 140 0.3 0.4 0.8 VCC1+0.5 200 0.04 mW/sr mW/sr _ nm A V
Notes a. Tamb = 25_C, VCC = 2.7 - 5.5 V unless otherwise noted. b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum. c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. d. IRED Operating Current can be adjusted by variation of R1 e. In agreement with IEC 825 eye safety limit
Recommended Circuit Diagram
The only required components for designing an IrDA 1.2 compatible design using TEMIC SIR transceivers are a current limiting resistor to the IRED. However, depending on the entire system design and board layout, additional components may be required (see Figure 1). It is recommended that the capacitors C1 and C2 are positioned as near as possible to the transceiver power supply pins, as in the proposed layout in Figure 1. A tantalum capacitor should be used for C1, while a ceramic capacitor should be used for C2 to suppress RF noise. Also, when connecting the described circuit to the power supply, low impedance wiring should be used. R1 is used for controlling the current through the IR emitter. For increasing the output power of the IRED, the value of the resistor should be reduced. Similarly, to reduce the output power of the IRED, the value of the resistor should be increased. For typical values of R1 see Fig 2. For IrDA compliant operation, a current control resistor of 8-12 is recommended. The upper drive current limitation is dependent on the duty cycle and is Pending--Rev. A, 03-Apr-98 given by the absolute maximum ratings on the data sheet and the eye safety limitations given by IEC825-1.
VCC2 VCC1/SD TFDx4x00 R2 Rxd Txd GND C1 C2 IRED IRED Cathode Anode Rxd VCC1/SD GND Txd SC NC R1
SC Note: Outlined components are optional depending on quality of power supply.
Figure 1. Recommended Application Circuit R2, C1 and C2 are optional and dependent on the quality of the supply voltage VCC1 and injected noise. An 5
Pre-Release Information
TFDU4100/TFDS4500/TFDT4500
unstable power supply with dropping voltage during transmission may reduce sensitivity (and transmission range) of the transceiver. Table 1. Recommended Application Circuit Components
Component
C1 C2 R1 R2
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Shutdown
The internal switch for the IRED in TEMIC SIR transceivers is designed to be operated like an open collector driver. Thus, the VCC2 source can be an unregulated power supply while only a well regulated power source with a supply current of 1.3 mA connected to VCC1/SD is needed to provide power to the remainder of the transceiver circuitry in receive mode. In transmit mode, this current is slightly higher (approxiamately 4 mA average at 3V supply current) and the voltage is not required to be kept as stable as in receive mode. A voltage drop of VCC1 is acceptable down to about 2.2V when buffering the voltage directly from the VCC1 pin to GND by a 470 nF ceramic capacitor (C1) and a 51 serial resistor (R2) is used (see figure 1).
Recommended Value
100 nF, Ceramic (use 470 nF for less stable power supplies) 1 F, Tantalum 8.2 , 0.25 W (recommend using two 0.125 W resistors in parallel) 22 - 47 , 0.125 W
The sensitivity control (SC) pin allows the minimum detection irradiance threshold of the transceiver to be lowered when set to a logic HIGH. Lowering the irradiance threshold increases the sensitivity to infrared signals and increases transmission range up to 3 meters. However, setting the SC pin to logic HIGH also makes the transceiver more susceptible to transmission errors due to an increased sensitivity to fluorescent light distrubances. It is recommended to set the SC pin to logic LOW or left open if the increased range is not required or if the system will be operating in bright ambient light. The guide pins on the side-view and top-view packages are internally connected to ground but should not be connected to the system ground to avoid ground loops. They should be used for mechanical purposes only and should be left floating.
300 250
Intensity I (mW/sr) e
This configuration minimizes the influence of high current surges from the IRED on the internal analog control circuitry of the transceiver and the application circuit. Also, board space and cost savings can be achieved by eliminating the additional linear regulator normally needed for the IRED's high current requirements.
200 150 100 50
5.25 V, Min. Efficiency, Min. VF, Min. RDSon
4.75 V, Min. Efficiency, Min. VF, Max. RDSon
The transceiver can be very efficiently shutdown by keeping the IRED connected to the power supply VCC2 but switching off VCC1/SD. The power source to VCC1/SD can be provided directly from a microcontroller (see Figure 3). In shutdown, current loss is realized only as leakage current through the current limiting resistor to the IRED (typically, 5 nA). The settling time after switching VCC1/SD on again is approxiamately 50 s. TEMIC's TOIM3232 interface circuit is designed for this shutdown feature. The Vcc_SD, S0 or S1 outputs on the TOIM3232 can be used to power the transceiver with the necessary supply current.
IrDA Field of View: Cone of "15_ 0 4.0 6.0 8.0 10.0 12.0 14.0 16.0
Current Control Resistor, Rl (W)
Figure 2. Ie vs Rl
If the microcontroller or the microprocessor is unable to drive the 1.3-mA supply current required by the transceiver, a low-cost SOT-23 pnp transistor can be used to switch voltage on and off from the regulated power supply (see figure 4). The additional component cost is minimal and saves the system designer additional power supply costs.
6
Pending--Rev. A, 03-Apr-98
Pre-Release Information
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Semiconductor
TFDU4100/TFDS4500/TFDT4500
Shutdown (Cont'd)
IIRED + _ Regulated Power Supply 50 mA RILIM TFDU4100 (Note: Typical Values Listed) Receive Mode @5 V: IIRED = 300 mA, IS = 1.3 mA @2.7 V: IIRED = 300 mA, IS = 1.0 mA Transmit Mode @5 V: IIRED = 300 mA, IS = 5 mA (Avg.) @2.7 V: IIRED = 300 mA, IS = 3.5 mA (Avg.)
Power Supply
IRED Anode Microcontroller or Microprocessor 20 mA IS VCC1/SD
Figure 3.
IIRED + _ Regulated Power Supply 50 mA R1 TFDU4100 (Note: Typical Values Listed) Receive Mode @5 V: IIRED = 300 mA, IS = 1.3 mA @2.7 V: IIRED = 300 mA, IS = 1.0 mA Transmit Mode @5 V: IIRED = 300 mA, IS = 5 mA (Avg.) @2.7 V: IIRED = 300 mA, IS = 3.5 mA (Avg.)
Power Supply
IRED Anode IS Microcontroller or Microprocessor 20 mA VCC1/SD
Figure 4.
Pending--Rev. A, 03-Apr-98
7
Pre-Release Information
TFDU4100/TFDS4500/TFDT4500
TFDU4100 - BabyFace (Universal) Package Mechanical Dimensions
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8
Pending--Rev. A, 03-Apr-98
Pre-Release Information
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Semiconductor
TFDU4100/TFDS4500/TFDT4500
TFDS4500 - Side View Package Mechanical Dimensions
TK84 731 TFDS 4500
Pending--Rev. A, 03-Apr-98
9
Pre-Release Information
TFDU4100/TFDS4500/TFDT4500
TFDT4500 - Top View Package Mechanical Dimensions
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TK84 731 TFDS 4500
10
Pending--Rev. A, 03-Apr-98
Pre-Release Information
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TFDU4100/TFDS4500/TFDT4500
Recommended SMD Pad Layouta
TFDU4100 BabyFace (Universal) Package
TFDT4500 Top View Package TFDS4500 Side View Package
(note: leads of the device should be at least 0.3 mm within the ends of the pads. Pad 1 is longer to designate pin 1 connection to transciver)
a.
The leads of the device should be soldered in the center position.
Pending--Rev. A, 03-Apr-98
11
Pre-Release Information
TFDU4100/TFDS4500/TFDT4500
Recommended Solder Profile
260 240 220 200
C)
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10 s Max. @ 230 _C 2 - 4 _C/Seconds
180 160 140 120 100 80 60 40 20 0 0 50 100 150 200 250 300 350 2 - 4 _C/Seconds 120 - 180 Seconds 90 s Max.
Temperature (
_
Time (Seconds)
Current Derating Curve
600
500
Peak Operating Current (mA)
400
300 Current derating as a function of the maximum forward current of IRED. Maximum duty cycle: 20%
200
100
0 -40 -20 0 20 40 60 80 100 120 140
Temperature (_C)
12
Pending--Rev. A, 03-Apr-98
Pre-Release Information

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